Eunil H.A. Americas has added the PARMI SPI HS30 in-line solder paste inspection system to its product line. The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to ...
Key Capabilities: DFM Analysis · Valor NPI · Virtual Assembly · Yield Optimization · Component Spacing Analysis ...
Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...
Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...
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