The U.S. Patent and Trademark Office on Thursday published an Apple filing for a unique encapsulation structure which holds both a fingerprint sensor and its conductive bezel, allowing for a smaller, ...
OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it has commercialized an encapsulation material having a high dielectric constant that is suitable for finger-print ...
(a) Schematic of the proposed laser-induced double-layer films compared to the conventional thermal sintering. (a-i) Schematic of the material and morphology of the film before and after laser direct ...
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