Researchers and industries have been using transmission electron microscopy (TEM) to study semiconductors' stacking and dislocation faults. This article considers the analysis of crystal structures.

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

Unlike optical microscopy, SEM does not rely on light waves but instead uses a beam of electrons to interact with materials, enabling magnifications up to 300,000× and resolutions approaching 1 nm. 1 ...

In this interview, AZoMaterials speaks with Mark Bumiller, Technology Manager for the AMH Instrumentation Division at Entegris, about particle size and count monitoring of CMP slurries and its role in ...