STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to ...

STMicroelectronics (ENXTPA:STMPA) has introduced the VL53L9 3D LiDAR module for edge AI systems. The company has also launched the ST54M secure mobile chip, which includes a hardware accelerator for ...

Learn more STMicroelectronics N.V. STM dropped the veil on its revolutionary innovation, FlightSense VL53L9, which is a compact direct Time-of-Flight (dToF) 3D LiDAR module designed to deliver ...

STMicroelectronics has unveiled the VL53L9, a compact direct Time-of-Flight (dToF) 3D LiDAR module designed to support a wide ...

On Wednesday, semiconductor contract manufacturing company STMicroelectronics NV (NYSE:STM) introduced the first product of its strategic collaboration with wireless technology company Qualcomm Inc ...

Geneva, March 16, 2026 - STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene ...

STMicroelectronics has introduced the Teseo-VIC3DA, the latest member of the Teseo module family, designed for vehicle positioning. Teseo-VIC3DA combines ST’s high-performing Automotive Teseo III GNSS ...

ST narrowband internet of things (NB-IOT) module certified by Deutsche Telekom STMicroelectronics announces new capabilities of NB-IOT and geolocation module, now certified for Deutsche Telekom ...

Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully ...