KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global ...
The high 300A rated current makes the BSM300D12P2E001 suitable for high power applications such as large-capacity power supplies for industrial equipment, while 77% lower switching loss vs.
Santa Clara, CA and Kyoto, Japan, March 20, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced that precision power analog company Apex Microtechnology is adopting ROHM’s silicon carbide (SiC ...
ROHM has released three reference designs REF68005, REF68006, and REF68004 for three-phase inverter circuits incorporating its EcoSiC brand SiC molded modules HSDIP20, DOT-247, and TRCDRIVE pack. The ...
KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant ...
When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation. · GlobeNewswire Inc. In high power conversion circuits, while SiC power devices ...
Rohm Semiconductor and Shenzhen BASiC Semiconductor have entered into a strategic partnership agreement to develop SiC power devices for automotive applications. The partnership will leverage each of ...
Promote the adoption of high-efficiency power conversion using SiC in a wider range of applications. · GlobeNewswire Inc. Santa Clara, CA and Kyoto, Japan, March 12, 2026 (GLOBE NEWSWIRE)-- ROHM ...
Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...
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