TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module ...
The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, ...
Integration in the radio-frequency (RF) front end of Global System for Mobile Communications (GSM) mobile handsets is continuing to advance through the use of modules, from front-end modules (FEMs) to ...
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