Semiconductor Engineering

Demystifying Mirror Types

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP ...
Forbes

Why Nonprofits Can’t Afford To Ignore The Rise Of The AI Stack Layer

Saurav Bhattacharya is a cybersecurity engineer and the founder of The New World Foundation – exploring digital identity, AI and privacy. Cyber defense is at a breaking point. Attacks are increasing ...
Morningstar

The Three-Layer Counter-UAS Stack: VisionWave Assembles RF + Computer Vision + AI Video Analytics Architecture with Foresight Investment

Issued on behalf of VisionWave Holdings, Inc. VisionWave Holdings (NASDAQ: VWAV) signs a non-binding term sheet to acquire up to 51% of Foresight Autonomous Holdings (NASDAQ: FRSX), adding ...
Linux Journal

Book Review - The Linux TCP/IP Stack: Networking for Embedded Systems

Thomas Herbert's book The Linux TCP/IP Stack: Networking for Embedded Systems is a thorough guided tour of the Linux kernel TCP/IP implementation. Herbert builds his description of Linux networking, ...
EDN

Guide to Embedded Systems Architecture – Part 3: Transport layer (UDP) and embedded Java and networking middleware examples

The two most common transport layer protocols are the transmission control protocol (TCP) and the user datagram protocol (UDP). One of the main differences between the two protocols is reliability.
Semiconductor Engineering

Thermal Analysis Of 3D Stacking And BEOL Technologies

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...