STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industr…

STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to ...

STMicroelectronics (ENXTPA:STMPA) Launches LiDAR And Post Quantum Mobile Security Chip

STMicroelectronics (ENXTPA:STMPA) has introduced the VL53L9 3D LiDAR module for edge AI systems. The company has also launched the ST54M secure mobile chip, which includes a hardware accelerator for ...
Electronics Weekly

Compact ToF 3D module has multiple uses

Next month ST will begin volume production of a compact direct Time-of-Flight 3D LiDAR all-in-one module which delivers AI-ready output data for low-compute edge AI systems on small MCUs and ...
New Electronics

STMicroelectronics' compact VL53L9 3D LiDAR module targets edge AI applications

STMicroelectronics has unveiled the VL53L9, a compact direct Time-of-Flight (dToF) 3D LiDAR module designed to support a wide ...
Hosted on MSN

This new 3D chip could smash AI’s biggest bottleneck

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
New Electronics

Sony and imec develop high-density backside interconnect technology for 3D chips

Sony Semiconductor Solutions and research institute imec have announced a new integration approach designed to improve the ...
Science Daily

This new 3D chip could break AI’s biggest bottleneck

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...